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What Custom IC Design Challenges are you facing now?

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發表於 2007-11-12 17:38:00 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Please select the following issues that you believe EDA Tool Vendors should invest in based on your experience and design needs. :o * J$ e0 h$ B1 O9 m( h' O6 Q( u
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Add your comments to further explain how these issues are impacting your design process. And let's discuss these before 2008.
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1.Time and schedule
' @0 `. C% d% w# I; M+ d2.Parallel designs e.g. layout and design engineering working at the same time
, c" J; F" q( N3 a/ @+ o3.DRC/LVS/ANT verification- r* Y- ^& y/ [, |% d* j! ^9 }3 W
4.DFT
! t6 D5 L* I  E5.Working in a multi user environment. m6 R; P: h, P7 S6 M5 ^: e
6.Incorporating latest process node specifics (e.g. .65, .45 CMOS)
) j( h: x* y# H3 b' d0 Q: s7.More than Moore technologies, such as high voltage design, high frequency design, high current design, high temperature design, multiple   

* ?1 }* N" z8 w8 O# v+ w   technology support in a single design, Mems
: I( S% Y7 H/ J6 L. S$ B8.Incorporating RF blocks into standard designs (RF SoC Design)" Z  S; W: j- i
9.Dealing with low-power design constraints in an analog world) ]$ s8 P/ A! m5 ^' o  D6 k1 n
10.Entering, tracking and verifying design intent between electrical and physical design, O0 @' Y" j7 V& t$ B1 m5 k: x# A! v; ^
11.Assessing parasitic sensitivities prior to full layout 1 y- ]7 B3 K  U2 l- a2 k; [! A
12.Optimizing circuit construction at 65nm and below * P# V1 _1 a' `; n% a4 N
13.Techniques for design centering to achieve optimum performance / yield
* q$ `1 c& S7 F14.Designing up to to six-sigma yield margins
' J; _* G8 D% K: k- Y1 M15.Other, please specify:
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