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標題: [Call for Papers]e-Manufacturing & Design Collaboration Symposium [打印本頁]

作者: jiming 時間: 2009-8-11 04:46 PM
標題: [Call for Papers]e-Manufacturing & Design Collaboration Symposium
台北國際會議中心四樓貴賓廳

The only arena for experts and professional s in areas of Open Innovation, Supply Chains,
Logistics, Design for Manufacturing, Engineering and IT Infrastructures in the industry, TSIA has
invited 9 heavy-weight speakers from world-class companies to share with the general public
grand visions and practical experiences in their own fields respectively. Subject areas are
covered from the perspectives of IC-designers, chipmakers, software-solution providers,
hardware-tool manufacturers, fab-operators and academic researchers. Over 5 CEO/CTO/VPs
take turns to discuss the most recent developments and point out future trends in the uncharted
territories of advanced technology nodes of semiconductor, LCD, PV and LED.

Who Should attend--- IC-designers, capacity planners, process creators, hardware
manufacturers, software solutions providers, academics, researchers, frontline engineers and
managers.

Extra value for your registration fee with exceptional level of expertise in the respective fields
thanks to the authoritative figures of the keynote/invited speakers!

	Session I ─ Business Operatives
Time	Topic	Speaker	Association
08:30	Registration
09:00	Opening & Welcome Address	Dr. TY Wu Mr. Thomas Chen Mr. Terry Tsao Dr. Jeremy Wang	TSIA tsmc SEMI GSA
09:05	keynote speech ─ Collaborate to Overcome New Design Complexity Barrier	Dr. Shauh-Teh Juang	Senior Director, TSMC
09:50	Integrated Innovation and Collaboration in a Semiconductor Disintegrated Ecosystem	Dr. Jaushin Lee	President and CEO, Imera Systems
10:20	tea break
10:40	Enablers for Manufacturing Technology Integration	Mr. Reiner Missale	CEO, Critical Manufacturing S.A.
11:10	IP Royalty management in Semiconductor Industry	Mr. Sajkumar K	Vice Presiden of Hi-Tech Industry, SAP APJ
11:40	Achieving optimal efficiencies of vertical integrations along a horizontal supply chain	Mr. Yih-neng Lee	VP and General Manager, Verigy Ltd
12:10	lunch break
	Session II ─ Technology Operatives
13:30	keynote speech ─ Globalization and Innovation	Mr. Ron Kao	General Manager, Broadcom Taiwan Design Center & Asia Business Development
14:15	A Pattern-Based Design Platform for High Manufacturability	Dr. Kimon W. Michaels	VP Design for Manufacturability, PDF Solutions, Inc.
14:45	Gaining a Competitive Advantage with DFM	Ms. Shu-Wen Chang	Foundry Program Manager, Mentor Graphics Taiwan
15:15	End-to-End Product Information Integration for the Semiconductor Industry	Mr. You-Min Lin	Business Consultant, Siemens PLM Software
15:45	tea break
16:05	Yield Mine for WAT Issue Investigation	Yi Feng Lee	Inotera
16:35	A modified PLS based d-EWMA controller for furnace process	James Yang	Nanya Technology Corporation
17:05	Effective Mechanism and Recipe Creation for Adaptive Test Time Reduction and Quality Improvement	B.C. Wu	NXP Semiconductors Taiwan Ltd.

Note: the organizers reserve the right to make amendments to contents of the final program.

Register now to save 50% of discounts before rate doubles in September!
http://www.tsia.org.tw/seminar/eManufacturing/2009/Registration.html

作者: mister_liu 時間: 2012-5-2 05:30 PM
標題: e-Manufacturing & Design Collaboration Symposium 2012
September 4, 2012
The Ambassador Hotel HsinChu, Taiwan

Abstract Submission due date: June 1, 2012

Important Dates
Deadline of submission-------------June 1, 2012
Notification of acceptance---------June 20, 2012
Final paper due-----------------------July 27, 2012
Deadline for early-registration----August 12, 2012

More information please refer
http://www.tsia.org.tw/seminar/eManufacturing2012/

作者: mister_liu 時間: 2012-5-2 05:30 PM
Scope –
The Symposium attends to recent technological advancements to align the needs of designers, manufacturers,
equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange
of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of
supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of
interests:

Advanced Lithography
Benefits and Justification (ROI, CoO, OEE ...)
Contamination Control and Ultraclean Technology
Control Architecture/Engineering/IT Infrastructure
Cross-industrial Applications of PV/SSL/FPD/…
Data Collection/Quality/Storage/Management
Design for Manufacturing/Testing/Yield
e-Diagnostics, e-Manufacturing, and EEC
Engineering/Supply/Value Chains
Environment, Safety and Health
Equipment Control/Integration
Fab Management/Scheduling/Dispatching
Factory Design & Automated Material Handling
Factory Integration/Operations
Factory Physics & Queueing Operations 
Fault Detection/Classification and Sensors
Final/Lean/Green Manufacturing
Manufacturing Control and Execution Systems
Manufacturing Strategy and Operation Management
Next Generation Factory & 450mm Wafers
Predictive/Preventive Maintenance
Process and Material Optimization
Process and Metrology Equipment
Process Control and Monitoring
Process Modeling and Model-Based Simulations
Process/Tool/Sensor Integrations
Standards (Equipment, Communications, …)
Through Silicon Via & 3D Structures
Ultra High Productivity in High-Volume Manufacturing
Yield Enhancement and WIP Management

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