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[好康相報] 7/29 Cadence Tech Forum 2010

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發表於 2010-6-28 14:28:11 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式

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9 B, g- n. K. Z; S, c9 I" ZCadence益華電腦為電子設計產業提出設計的未來之路!  提供一個從設計開始到系統整合,適合於系統整合、應用開發與系統驗證的完整平台,這就是Cadence所勾勒出的EDA未來之路。EDA360願景能夠讓半導體公司建立威力強大的產品,讓消費性技術供應商能夠運用硬體、軟體與服務結合的生態系統,提供元件平台,能夠幫助公司具備更高競爭力與獲利力。
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( Y; {7 u" T& B& ]6 H# E, ] Cadence Tech Forum 2010讓所有電子產業設計專家能夠會見彼此,與Cadence益華電腦使用者、設計開發工程師, 和各業界專家一同討論,一同激勵電子設計產業的新願景。同時Cadence Tech Forum 2010亦提供了一個機會,了解 Cadence 益華電腦和其他友好夥伴共同開發的解決方案,與如何運用 Cadence益華電腦技術進行創新與研發。+ k' T) k% F$ `. g& s$ [3 S; B$ ?% o1 b
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 今年Cadence Tech Forum 2010活動議題涵蓋廣泛,其中包括幾個最令人矚目的話題: 低功耗設計、先進製程下的設計實現、正規驗證、 constraint-driven設計、系統封裝設計和電子系統層級設計等。$ B6 l! Y5 H! P
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 歡迎參加Cadence Tech Forum 2010,讓你有機會更進一步了解Cadence益華電腦新的解決方法和產品特性,以及未來產品願景與策略。
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 樓主| 發表於 2010-6-28 14:28:57 | 只看該作者
TimeSpeech/
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TopicSpeaker
09:00~09:30Registration
09:30~09:40OpeningWelcome Remark

Veronica Watson,4 P0 v5 Y5 g& p( J. N3 j
AP President of Cadence Design System
  K/ {3 t! y5 z4 P1 nWillis Chang, 0 _+ ^: L; J6 X8 o& z3 ~% \
Country Manager of Cadence Taiwan
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09:40~10:10Keynote EDA 360: The Way Forward for Electronic Design

Charlie Huang,
# {4 t/ ~4 t; @0 ]Senior Vice President and ! l! b! ~6 w4 K
Chief Strategy Officer

10:10~10:40% H! |2 s) d- c4 u
Keynote
Cadence open integration platform with integration-optimized IPBrian Gardner,
  D$ d$ D" Z! {9 ?- K1 oGroup Marketing Director, New Business, Cadence
10:40~11:00Break (Proceed to Breakout Rooms)
Custom Design / T  H: S1 z; q
(Meeting room A&B, 13F)
11:00~11:50CD01TSMC AMS Reference Flow

M. J. Huang,
) `- y: C9 i) h' ^* F( ?1 Y8 HTSMC

11:50~13:30Lunch
13:30~14:20CD02Virtuoso IC Design Platform 6.1.4 - Analog Design Exploration and OptimizationAlex Wang
14:20~15:10CD03Virtuoso What's New 6.1.4 - Virtuoso Advancing the Art of Custom Design Kevin Tsai
15:10~15:40Break
15:40~16:30CD04Advanced 32/28nm Node Challenges & Solutions - Enabling Fastest Time-to-VolumeEason Lin
Functional and System Verification
2 l0 I( {. t# t! _0 c(Ballroom C, 10F)
11:00~11:50FV01Predictable System RealizationMichael McNamara
11:50~13:30Lunch
13:30~14:20FV02
9 e/ P# T7 s2 Y; p7 x  }Cadence TLM Design & Verification with C-to-Silicon Compiler
Mark Warren
14:20~15:10FV03Cadence TLM to GDSII flowRich Owen
15:10~15:40Break
15:40~16:30FV04Cadence TLM Verification Cadence Expert
Digital Implementation " i1 P* S" S' z# b) g) }) `2 S
(Ballroom A, 10F)
11:00~11:50DI01Digital Implementation Update at TSMC Reference Flow 11 Cadence Expert
11:50~13:30Lunch
13:30~14:20DI02DoT/MSoT for Mixed Signal Demo Mladen Nizic
14:20~15:10DI03EDI System Roadmap: Encounter Digital Implementation System - Enabling "More than Moore"Wei Lii Tan
15:10~15:40Break
15:40~16:30DI04EDI System 9.1 UpdateCadence Expert
Logic Design ' B% v- C& M: `: T  O5 f
(Ballroom B, 10F)
11:00~11:50LD01Cadence Logic Design Product RoadmapYoon Kim
11:50~13:30Lunch
13:30~14:20LD02Phyical Predictability in RTL Compiler SynthesisMark Ou
14:20~15:10LD03Conformal ECO DesignerB. C. Shih
15:10~15:40Break
15:40~16:30LD04Can your spreadsheet do this ---- Innovative applications of pre-RTL chip planningAnis Uzzaman
System and IC Packaging ' E( G+ x+ [/ A2 n* X9 M3 {) S
(Meeting room C, 13F)
11:00~11:50SPB01SiP and 3DIC/TSV Design in TSMC Reference Flow 11.03 x; q! q1 f. C0 v
Mike Peng, : ]6 T8 X9 c" V' T: p- z) |
TSMC
11:50~13:30Lunch
13:30~14:20SPB02What's New Update for 16.3 Allegro Package Design and SI Simulation?

Joseph Kao
! P9 j6 t5 i3 t: aThunder Lay

14:20~15:10SPB03Distributed Co-design for IC-Package-BoardThunder Lay
15:10~15:40Break
15:40~16:30SPB04Design issues from IC to package: Managing Package Outsourcing EngineeringKevin Liu
16:30~16:45Lucky Draw(Ballroom A, 10F)

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