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TSMC 193-nm Immersion Lithography and Its Successors 講議分享 |
講者:Mr. Burn Lin, Sr. Director, TSMC 台灣積體電路製造股份有限公司資深處長 林本堅 博士
41p, 2MB PDF, 4 RDB • Water immersion at 1.35 NA can support 32nm node at 45nm half pitch. • Litho technology for 22nm node at 32nm half pitch is not settled. • We will discuss 4 possibilities here
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