標題: 5/11 Taiwan Yield Forum 2010 [打印本頁] 作者: chip123 時間: 2010-5-4 08:15 AM 標題: 5/11 Taiwan Yield Forum 2010
2010 Technology and Applications Forum
Sponsored by Rudolph Technologies
Returning to Hsinchu, Tuesday, May 11
Ambassador Hotel, 188 Chung Hwa Road
Inspection and Metrology Process Characterization
Cost-saving Yield Management Solutions
Process Control Solutions-Fabwide
Guest speakers from Top Fabs, Equipment Manufacturers
SEMATECH's 3D Interconnect Program: Using all-surface inspection in an R&D environment
2010 Agenda Highlights
Wafer Fab (front-end)
All-surface inspection for immersion lithography
Advanced macro CMP monitoring
Defect analysis/signature pattern characterization
Characterization of High k/metal gate using MetaPULSE
Improving the COO model for thin film metrology
On product monitoring of Cu Seed Barrier
Focused beam ellipsometry for advanced applications: gate oxide,
ONO, SiGe
Real-time fault prediction using ARTIST FDC
System Integration: Optimizing resources for improved yield
Assembly & Test (back-end)
Inspection trends in the back-end
Reducing review for back-end processes
Challenges in inspecting fan-out wafer level packages
Solutions and approaches to TSV inspection and metrology
CMOS image sensor inspection solutions
3D Inspection, RDL and Gold bump
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0830- Registration, Refreshments
0900- Welcome, Keynote Address
1230- One-hour lunch
1700- Refreshments
This event is free of charge and includes parking.
Registration closes May 7.
