我也来分享一些示波器的资料

vili

测试高速串行设计
$ F' G3 c: Q8 [SATA
FBDIMM
PCI Express
HDMI
+ C  n8 u! \& J# @# g
9 D' Z  _3 \9 m. _: v: |

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VoIP一致性、互操作能力和性能測試-Chris Kirk

" G" O5 k! c3 N

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Table of Contents
# |! Q: A3 E) V# d* Y$ [Probes – The Critical Link To Measurement Quality . . . . . . . . .5
What is a Probe? . . . . . .5
* _2 d4 |% P+ J, V/ VThe Ideal Probe . . . . . . .6
4 _: Z* N. a/ D' t$ L1 i+ F) W* WThe Realities of Probes . 7
$ j( h" ^+ R  [- o( OChoosing the Right Probe .10
: a& b8 t% W6 r, `# p9 e1 BSome Probing Tips . . . .11
: a; z& {: S# m: DSummary 12
Different Probes for Different Needs . . . . . . . . .13
; P# E5 a2 q6 f4 v1 G' u+ h4 mWhy So Many Probes? .13
Different Probe Types and Their Benefits . . . . . . . .14
0 p5 ^3 E: c+ k0 zFloating Measurements .19
2 N) v' E$ o* l% f/ b5 y& n, rProbe Accessories . . . .20
& `$ ?6 t2 u9 Q" o9 xHow Probes Affect Your Measurements . . . . . . 22
The Effect of Source Impedance . . . . .22
3 H8 O& i$ F- u4 qCapacitive Loading . . . .22
) Y0 @- X9 v; s' z8 Q2 XBandwidth Considerations 24
What To Do About Probing Effects . . . .28
1 w) P6 b/ j6 T. Y! L9 y- tUnderstanding Probe Specifications . . . . . . . .29
Aberrations (universal) . 29
* H6 h( F2 O7 uAmp-Second Product (current probes) .29
Attenuation Factor (universal) . . . . . . .29
% `" E3 u- P0 ~Accuracy (universal) . . .29
Bandwidth (universal) . .30
, I, p. i2 J6 XCapacitance (universal) .30
CMRR (differential probes) . . . . . . . . .30
" l/ W/ v+ _4 [  QCW Frequency Current Derating (current probes) . . .31
9 a( s1 h( b' b9 B4 mDecay Time Constant (current probes) .31
2 ~9 ^1 V: n  k& o$ B5 uDirect Current (current probes) . . . . . .31
/ V% w/ g' x8 \. z' k/ t1 aInsertion Impedance (current probes) . .31
0 R) B+ L/ a' |/ M& X. H2 QInput Capacitance (universal) . . . . . . . .31
Input Resistance (universal) . . . . . . . . .31
- d. s" n% o! g1 F% JMaximum Input Current Rating (current probes) . . .31
7 {& X6 l& Q' iMaximum Peak Pulse Current Rating (current probes) .31
Maximum Voltage Rating (universal) . . .31
, R9 c9 u1 f4 }+ C8 n. Q! \) GPropagation Delay (universal) . . . . . . .31
Rise Time (universal) . .31
+ I. u  k8 o7 H& n1 F6 q+ wTangential Noise (active probes) . . . . .31
Temperature Range (universal) . . . . . .31
5 f+ `/ W2 f; t0 H! V+ ]. z1 Q' oA Guide to Probe Selection . . . . . . .32
+ [1 b$ s1 [! A- s" X9 B/ ?7 pUnderstanding the Signal Source . . . . .32
Oscilloscope Issues . . .34
Selecting the Right Probe 35
Advanced Probing Techniques . . . .36
; z/ @9 E6 H' t( l9 }Ground Lead Issues . . .36
Differential Measurements . . . . . . . . .39
" f) X/ b6 e$ U$ O" E* B; R4 uSmall Signal Measurements . . . . . . . . 42
- U" l# O: y8 @% I! p+ cExplanation of Safety Precautions .44
* M9 G& H( x" T; t. |. h% v! W8 ~Observe All Terminal Ratings . . . . . . . 44
9 w6 c. S% W. ~/ bUse Proper Grounding Procedures . . . .44
Connect and Disconnect Probes Properly . . . . . . . .44
7 I7 }$ H" N( m6 uAvoid Exposed Circuitry . .45
Avoid RF Burns While Handling Probes .45
9 B1 e& z& V9 Y" W' V# d$ K, \3 VDo Not Operate Without Covers . . . . . .45
Do Not Operate in Wet/Damp Conditions . . . . . . . .45
Do Not Operate in an Explosive Atmosphere . . . . . .45
2 u/ W3 W% S7 n) bDo Not Operate with Suspected Failures . . . . . . . . .45
Keep Probe Surfaces Clean and Dry . . .45
Do Not Immerse Probes in Liquids . . . .45
- l5 [% v3 T' U  ^& P5 SGlossary
( ^" u" s3 Z3 [
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ABCs of Probes          
1. Introduction ....1
2. Digital Basics  ....3
1 v8 H* D# G0 z% l8 r$ ^2 MComponent and Composite (analog).... 3
Sampling and Quantizing .... 4
8 H" \7 w8 J8 Y/ K3 `Digital Video Standards.... 4
Serial Digital Video .... 8
) Y9 l. N6 d' Z! t0 ]Rate Conversion – Format conversion ....10
' y6 Z  K7 _+ |0 ]3. Digital Audio ......11
: j! D! d  l, z# v: l' c, ?/ |0 wAES/EBU Audio Data Format ....11
7 ^* F8 I2 M/ c4 G# kEmbedded Audio....11
4. System Hardware and Issues .... 19
- P! }  T4 r% H' ]2 [( BCable Selection ....19
8 \  L3 v# c: A3 I" a- FConnectors ....19
Patch Panels ....19
Terminations and Loop-throughs ....19
3 x2 {# f" B" m( m: v! YDigital Audio Cable and Connector Types .... 20
/ G: u1 `/ W% ?2 W5 m5 dSignal Distribution, Reclocking .... 20
System Timing ....20
5. Monitoring and Measurements .... 23
' U: {/ P- q$ C& k: {- ]6. Measuring the Serial Signal....25
Waveform Measurements .... 25
Measuring Serial Digital Video Signal Timing ....26
7. Definition and Detection of Errors .... 29
$ O( P# t( g9 k3 u% YDefinition of Errors .... 29
) V8 E. X$ ?5 SQuantifying Errors ....30
8 l$ y/ M- v6 _$ MNature of the Studio Digital Video Transmission Systems ....30
Measuring Bit Error Rates ....32
1 z0 L% T$ ]) p/ X* D9 SAn Error Measurement Method for Television....32
System considerations• • • • • •• • •• • 33
  F1 w8 h9 i3 I1 w. U8. Jitter Effects and Measurements • • • • • •• 35
Jitter in Serial Digital Signals • • • • • • • • 35
Measuring Jitter • • • • • • • • • 37
6 N3 G1 l" Z, g& k& ]9. System Testing • • • • • • • 39
9 s" _8 d+ `# t" b; eStress Testing • • • •  • • • • • • 39
$ P" [' b5 w4 f; XSDI Check Field • •  • • • • • 39
7 L( O' Q/ E: ^8 P' p- M10. Bibliography• • • • • • • • • 42
Articles and Books• • • • • • • 42
+ L3 S% q4 |: UStandards • • • • • • • • • 43
; K5 ?/ l6 p# ~: D9 l! Z11. Glossary • •• • •

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MPEG-2 Decoder Design & Test

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A Guide to MPEG Fundamentals and Protocol Analysis
(Including DVB and ATSC)

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Jitter Analysis:
( t" p8 ~; ~6 ?( \3 L+ X1 E& E* ]9 @Accuracy
Resolution
9 f3 O6 p# h: E5 ]" i/ \. n7 KJitter Noise Floor
( o  Z4 e# V& }: o, BDelta Time Accuracy

vili

The Most Comprehensive, Convenient and Cost-Effective Answer to Resolving Jitter Issues in Your Designs

PerformanceB

thanks for your share . great!!!!!!!!!!!!!!!!!!

bear_poppy

感謝大大的分享阿
, G! U2 }% U0 ^, S( p. C在公司用到
; _& X! ]8 U" p$ S- a1 q( F% L, d所以趕緊來看看囉
``~~~

t69292000

測試儀器的使用也是一門大學問!!!  謝謝大大的分享!!!  感謝至極!!!