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發表於 2008-9-12 11:18:59
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ABCs of Probes
Table of Contents
5 a" Q, q$ S! y- `Probes – The Critical Link To Measurement Quality . . . . . . . . .56 Y8 \( Z! a% F( Z- W' R. @+ q
What is a Probe? . . . . . .5
; e# i; u Z, I8 d' p* ]9 kThe Ideal Probe . . . . . . .6
: ~- I: n2 ?/ X: UThe Realities of Probes . 7. ~ Y, n! p+ N
Choosing the Right Probe .10
& m& U" i; }. j% ] sSome Probing Tips . . . .11' _6 e1 F |& c" G
Summary 12, B0 q3 _9 b; P: X
Different Probes for Different Needs . . . . . . . . .139 A$ p! ^5 T U, E& O( B& P
Why So Many Probes? .13! Q$ Y6 ?& F; _; n1 R' @
Different Probe Types and Their Benefits . . . . . . . .14
5 X/ d% m( [0 }" c+ OFloating Measurements .19
# g+ H, `. \# a3 p7 n! P1 f& sProbe Accessories . . . .20
- e5 p$ P7 _+ ^" `3 F3 ~3 Q4 {How Probes Affect Your Measurements . . . . . . 22
1 E1 b1 U2 n/ O, a3 {% \The Effect of Source Impedance . . . . .22# t1 L8 O) Q5 O: S
Capacitive Loading . . . .22
2 p' D3 [7 ~# H. }. `( Y- I: ^" @Bandwidth Considerations 241 Q+ F3 ^8 [+ I$ f( _3 H7 z
What To Do About Probing Effects . . . .28# g+ Z/ K7 u$ `* T
Understanding Probe Specifications . . . . . . . .29
" {7 |5 A) w+ I" V, GAberrations (universal) . 29
0 _5 U5 ^3 j/ g" T7 d6 A* D( _: [Amp-Second Product (current probes) .29; T8 n# b3 ?6 p$ ]/ v9 t, A! ?# i$ V
Attenuation Factor (universal) . . . . . . .297 ` X/ ?4 c/ ~
Accuracy (universal) . . .29
1 [4 s3 x) u5 C/ b0 nBandwidth (universal) . .300 k% G1 q; N7 W& R( v
Capacitance (universal) .30
( {0 d b/ `3 Y. ^ E( }% jCMRR (differential probes) . . . . . . . . .303 j6 z6 Z) P9 z6 J9 r) Z# _
CW Frequency Current Derating (current probes) . . .31: ?9 v& I* y x+ c {
Decay Time Constant (current probes) .319 n j! I$ U) H3 d Y4 f! |1 O, b
Direct Current (current probes) . . . . . .31) D" ^( U! u/ T; h8 |. P" P2 {
Insertion Impedance (current probes) . .31 u- ~( p6 ]& O5 B1 k* a
Input Capacitance (universal) . . . . . . . .31% p' v$ J0 J) }) k+ p% {! C% i! s, m
Input Resistance (universal) . . . . . . . . .31% G. e- a- U) U
Maximum Input Current Rating (current probes) . . .31
# Z! T4 ~2 Q: `* {& l' pMaximum Peak Pulse Current Rating (current probes) .31
* f2 d: G/ p( ~ r; b0 UMaximum Voltage Rating (universal) . . .31
d; M5 @; M3 t4 J- NPropagation Delay (universal) . . . . . . .31
0 f7 Z2 l1 ^* G6 N# R) m$ FRise Time (universal) . .31
( U, b8 S. T; bTangential Noise (active probes) . . . . .31
& }2 R5 O) V( C8 Y* Z$ QTemperature Range (universal) . . . . . .31
! h q# h B9 c# {, sA Guide to Probe Selection . . . . . . .32
' z4 j$ y: G3 N$ ~+ ZUnderstanding the Signal Source . . . . .32
" f, M4 }7 t+ t: p: m# e1 TOscilloscope Issues . . .34% c. x5 k% a- w3 X9 {
Selecting the Right Probe 35
" D P" ]% K- w RAdvanced Probing Techniques . . . .36
$ h" z4 Y" t, b: XGround Lead Issues . . .36
& ]* \9 R0 ^% k1 uDifferential Measurements . . . . . . . . .39
Z$ k1 T4 G# b9 N0 A* Y. XSmall Signal Measurements . . . . . . . . 42# z- N4 V0 I& W7 A
Explanation of Safety Precautions .44
+ [. y( n7 ^: f0 gObserve All Terminal Ratings . . . . . . . 44
; V# ~7 M$ e, P% o8 NUse Proper Grounding Procedures . . . .44
3 h5 Q, H+ ^; i9 hConnect and Disconnect Probes Properly . . . . . . . .449 I& Y; I' b8 E% N8 c, t
Avoid Exposed Circuitry . .45/ O- ?# d2 {( N% {
Avoid RF Burns While Handling Probes .455 q- n: D$ T/ y( w/ f9 J( Z9 h( R
Do Not Operate Without Covers . . . . . .45
9 o5 g* z) k) R, h4 E5 \Do Not Operate in Wet/Damp Conditions . . . . . . . .457 H- R; Y% O% ?) q- I: N6 i
Do Not Operate in an Explosive Atmosphere . . . . . .454 T! @5 ?' [: v6 t o3 h
Do Not Operate with Suspected Failures . . . . . . . . .45& y( V9 m+ e1 X) R5 o
Keep Probe Surfaces Clean and Dry . . .45
( L/ P7 L9 h1 Z" J4 v/ vDo Not Immerse Probes in Liquids . . . .45& T7 ^( C9 P# Q" `. G3 ]' ?8 j
Glossary( s; O0 k- E" p, N4 J/ T' ~
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