Gartner 分析表: M( t3 B; X+ b8 H& B # a. e; C( j ]' B; JSemiconductor Vendors Fill Gaps and Look to Provide Complete Wireless Platforms 8 o+ L, [& d* `$ s4 n* |% f. L# `0 X8 }( B e" d) |+ ~( H2 U$ Y
Gartner Net Result: By 2015, All Architectures Will Be Comparable On Power And Performance3 Q2 N" g* F& b% X: @% f
+ y; J, Y7 ~" J/ I: FBy 2015, move to advanced process nodes will enable all three architectures to meet performance and power needs of tablets3 @: O: y1 O3 P1 O! R& F
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By 2015: : c( ?: h1 r$ `& D4 F" YARM cores will scale to >2GHz/ `3 n* p+ T- e% |8 f* ?
Intel chips will aim for fanless TDP of <2W" y: }0 A& y F
MIPS will look for >3GHz, <200mW cores9 ^0 C: J/ o: w- S& W z6 B2 ^
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Integration will be a trend, wireless connectivity and sensors will be integrated with processors. ! g5 P1 [! t) S: n) u" M# V" ?% T( f) e3 d7 M' @" Z