10/2 Thin Wafer Processing for 3D TSV Applications Workshop

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Thin Wafer Processing for 3D TSV Applications WorkshopTaipei International Convention Center - 102 Conference Room
Friday, Oct 2nd 2009, 9:00 to 13:00This workshop discusses the current trends in 3D integration, highlighting the latest carrier wafer technology. Temporary wafer bonding and debonding have emerged as challenging processes necessary for most 3D integration schemes. The selection of the proper adhesive applied for temporary bonding is a key criteria. Electrical probing of 3D structures will also be introduced.
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Agenda

8:30-9:00 Registration

9:00-9:10 Welcome & IntroductionMr. Heinz Siegert, General Manager – SUSS MicroTec Taiwan

9:10-9:35 1 w7 X& E  q& [' s3D Technology with TSV: Challenges, Approach and Consolidation Dr. Robert Lo, Director Package Technology Division – ITRI

9:35-10:00 Cost Effective 3D System Integration Mr. Wim Sohier, Strategic Marketing Manager – Representative of IMEC Belgium

10:00-10:25 3 W) c$ T7 N; P6 JPermanent and Temporary 3D Bonding & Electrical Probing for 3D StructuresMr. Jim Hermanowski, International Product Manager Wafer Bonder – SUSS MicroTec Inc.

10:25-10:40 Coffee break

10:40-11:05 3D SIP Packaging Trend, Challenges and OpportunityDr. Kuo-Chung Yee, Corporate R&D VP – ASE

11:05-11:30 $ |3 g$ \$ G8 N7 R( Z1 V3M™ Wafer Support System, Enabling Ultra-thin Wafer Handling (Temp. Bonding Process)Dr. Roger Chiu, Sr. Product Development Engineer – 3M

11:30-11:55 DuPont Wafer Level Packaging Materials Characterization for Thin Wafer ProcessingMr. Toshiaki Itabashi, WLP Applications Development Leader – DuPont

11:55-12:20 " t( w: @6 d: ^( QWafer Support System for above 250 °C Back Side Processing and Cold De-BondingDr. Franz Richter, CEO – Thin Materials AG

12:20-12:30 2 q+ [2 l4 b$ J8 B. o8 Q" R/ `Questions and Answers

12:30-13:20 Lunch