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[經驗交流] ASIC設計工程師如何保住飯碗?

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41#
發表於 2014-6-12 10:46:55 | 只看該作者
Junior Physical Design Engineer' x4 h; j5 w3 o- M* K

& [5 ~* \; }2 M3 L3 r公      司: famous IC company# G( r- S% O. I$ i- O
工作地点:北京; x/ b, L) {: F! t, @8 S) w9 W

  b" Z7 M2 q! W& R* z+ I1 CPosition Tasks, Duties and Responsibilities 4 c4 h  |3 C* s( Z; f
The ASIC Physical Design Engineer will:
5 ?1 u/ G* j9 Y$ e* a        Complete third party IP integration and ensure vendor guidelines are followed.
* G7 k. n) ^8 Z+ ~6 e6 n        Responsible for physical verification (DRC/LVS).
8 @, j, h0 \1 a! `3 {: J; [        IO ring design, fullchip floorplan. + x, ^7 ^5 O1 r( [/ z; v
        Block level implementation. 0 x9 q3 |5 m8 F- E) e7 U- J
        Work with front-end engineers to resolve problems and achieve design closure.
. W4 [/ u' U, B/ s
# Q' t, F5 R! r! D, VCandidate Qualifications: 6 e7 I1 {, Z( L# j. C: u' J
Candidate must: ' }, S  D) v! S- f: t( r4 x8 O
        Hold BSEE (MS preferred). + c' y) `3 J0 W8 n" k2 d
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
2 U3 J! i% a1 [  S: M# x$ q) z! b        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
6 D8 F  `$ b4 V" i* g        Have the ability to independently identify and resolve design, tool, and flow problems.
! j  c& B2 p0 c! Q% |- `        Have related timing and physical concept. ) ^5 ]2 y5 L: h- B& l0 B& U
        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
( r( D& {1 p( Q        Familiar with EDA tools.
6 D. g# o# O! h6 W        Familiar with Linux environments.  
9 B* E  F0 c6 e; d- d& i+ n
8 l4 F; v) R. f+ R, d- ^& qAny of the following is beneficial:
% }7 e' q1 D2 ^- `        STA constraint design
3 s3 _) o, O5 v$ X+ V       Equivalence checking ?RTL to gates, and gates to gates.
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42#
發表於 2014-6-19 09:41:01 | 只看該作者
Junior Physical Design Engineer4 x* v8 Y4 D% k

( a* K: I1 h; O" m  W公      司:A famous IC company, u1 B+ W. R( o# j. ?
工作地点:北京% p/ P' G5 z: p  N3 z$ Y4 K
$ n0 @+ Q  l, I& G
Position Tasks, Duties and Responsibilities ( q# k) W) B) p# G
The ASIC Physical Design Engineer will: . E+ }& D- D# r0 h
        Complete third party IP integration and ensure vendor guidelines are followed. ( r7 q" S  G4 p2 `6 l+ w
        Responsible for physical verification (DRC/LVS).
' n; y+ z9 f* Q        IO ring design, fullchip floorplan.
* N* ~9 U' p8 @" s% D6 b        Block level implementation. & o# K" [, o. q0 Y! W# P1 W
        Work with front-end engineers to resolve problems and achieve design closure. * f3 C. U- ]& P/ O
% S, G$ ^6 @/ U1 \9 k2 b
Candidate Qualifications:
/ ?$ Q' x  C" L5 x& a. |Candidate must:
( b# \, A% O# @% J3 N. m7 h        Hold BSEE (MS preferred).
6 B3 R5 _* K( u+ J; w        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
! t( H! q4 Q2 r* q        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. + u" M' v; j) b6 k. a: p
        Have the ability to independently identify and resolve design, tool, and flow problems.
& R+ r# ?& Y8 N2 l* \( l        Have related timing and physical concept.
; S0 q* f$ Q, G2 i        Be able to design and implement physical design strategies and methodologies for deep submicron designs.  i' r, ^8 r4 s' ]
        Familiar with EDA tools. 6 G9 N- K& e# @( c9 W
        Familiar with Linux environments.  - A8 d, b7 i% m; d+ [

) E- o% v4 U) T' c% g. tAny of the following is beneficial: ! c8 y' l2 D( A! R
        STA constraint design
( Z9 _3 }) R+ r- ?; O. O       Equivalence checking ?RTL to gates, and gates to gates.
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43#
發表於 2014-6-19 09:42:41 | 只看該作者
Sr. ASIC Design Engineer (encoder/decoder)4 A# u; }8 e5 E% ]  q! A' m- y

* f! K8 G( M9 J5 `* c; M" _* D  D公      司:a leading developer of advanced digital imaging solution; h' i2 @, C9 R* V8 t2 @
工作地点:上海
: P7 y# |5 L7 y
3 \  M- D! {) K5 u  W% b5 F- k! DPosition Overview: The candidate will join a team of  highly competent ASIC designers involved in design, verification, and implementation (ASIC) of advanced platform for XX''s future generation multi-media products.   
& q3 e1 f0 n  w+ n% g! l- v
! N, p* E9 O  q, N. i" F主要职责 (70%)
! z, J! ]7 M2 YIn-depth knowledge of TV encoder and decoder design. Good understanding of TV system design.  $ @3 u& H! `3 g2 q3 I9 C
Proficiency on digital filter algorithms and hardware implementation.
# [2 [1 q8 X0 f) o9 iDevelopment and verification of complex IP module, integration of the IP module into the Soc devices, top-level design handling, system level testing. ( I* |. U9 b1 N1 g) ~' a
Participate in the FPGA platform development and lab debugging   
- h# y2 V3 M" S; x- C$ ~3 y6 l7 Z7 t/ N6 r7 @2 a5 w+ J
其他职责 (30%) 3 J8 a1 _) W. a9 `1 A9 o5 H& ?6 g
Participate in block level architecture design Assisting embedded FW development.. G) I2 S* R' H5 G& f2 G
职位要求6 e& e7 f* x5 f! X4 ^7 U
岗位资格
0 {% _# N; t9 u1 P7 y经验/技能
3 r% {4 y) i+ f8 J+ U0 E1. Strong knowledge of TV technologies, knowledge of image signal process and CCTV system is a plus ( I4 W% I' w# K2 I
2. Strong knowledge of ASIC design flow. Can define Micro-architecture of the IP module and /or sub-blocks. And able to write detailed engineering specifications. * r+ h! }" d( Z
3. Good communication skills, especially in technical writing and reporting;
" _, Y! h& s* V, [4. Self-motivated and ability to excel in a team environment.    * r+ C8 T# k; j0 \7 K- `8 q* B1 T

( d. F; O* R$ D" C* r教育
  D% T( i. k0 WMSEE/CE with 3+ years of industry experience
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44#
發表於 2014-6-20 09:03:13 | 只看該作者
Senior Digital Design Engineer0 u' [+ `; i2 i$ {" ^
) L9 g0 o- u# V& a
公      司:A leading semiconductor company
. l4 l8 S+ ~5 K1 Q! m工作地点:香港, v/ |  W3 p7 x5 G- d

  d7 w. E7 }* o* |. hJob Responsibilities: - K4 E# Y' ~& W. T1 d8 U
    Perform logic design, RTL coding, design verification, logic synthesis, DFT and static timing analysis 1 U! l! F/ b6 s$ H2 G0 l
    Develop verification environment and coverage closure 7 v: q$ r0 @  S- O0 G0 K5 n. J
    Support wafer level testing and silicon evaluation
$ o* b$ `* G6 U( [    Prepare technical documents
2 X: e: |) \3 ~/ ?$ `7 o, M0 ?& n' s  U
Job Requirements:
+ `: ]7 V+ @3 t, T8 F! C# d% x    B.Sc or above in Electronic Engineering or equivalent. Applicants with postgraduate degree would be considered as an advantage
+ s: B+ K% w( [$ x6 {    5 Years or above of solid experience in one or more of the following areas: Verilog-based logic design and synthesis, constrained random    testbench with System Verilog & UVM, assertion based design verification or circuit-level SPICE simulations 3 [: W/ v. f: Q% N' T
    Knowledge of SoC and embedded system. + R9 u, U- |( q0 _5 I; D1 K/ y  p
    Knowledge of scripting languages such as Perl, TCL and Make
- {' r* k. L" Y& V' N    Candidate with less experience will be considered as Digital Design Engineer
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45#
發表於 2014-6-24 11:57:06 | 只看該作者
Junior Physical Design Engineer& i) V% c4 n, `; I6 x7 w
公      司:A famous IC company& \6 r; f- Z+ c& T
工作地点:北京
$ S1 w* v' ^6 S! z: r8 I! c# c. V% E- d2 m
Position Tasks, Duties and Responsibilities
% t  J" z% T" W& U* G; A) zThe ASIC Physical Design Engineer will:
- A9 i' d- R5 Z        Complete third party IP integration and ensure vendor guidelines are followed.
, e3 r8 ]# ^, I# n( x5 _        Responsible for physical verification (DRC/LVS). 2 B- r7 j0 `6 k) @: `9 B; P+ M
        IO ring design, fullchip floorplan.
: I3 [2 F8 i( H" r# i4 M0 t5 n        Block level implementation.
7 g- p- [) U6 t, W        Work with front-end engineers to resolve problems and achieve design closure. 0 J8 X3 P, `+ N/ Y- T) W5 w
% Z/ p( D, w, H& V. k3 |
Candidate Qualifications:
8 d% {% @1 u) uCandidate must:
3 J# G  ]* G3 h% `        Hold BSEE (MS preferred).
1 b( O# n# W) a1 y' j8 c        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
9 ]& ]7 h2 [7 E+ E+ U& r" |        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. / v8 e5 _0 J9 ^" l
        Have the ability to independently identify and resolve design, tool, and flow problems. 4 a( L# w& k1 B* x
        Have related timing and physical concept.
5 l/ s8 [: T; a% u+ V$ |4 C8 x$ w; v2 |        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
; C3 T& B; |  g; S" {        Familiar with EDA tools.
5 M" A) A% Z$ D. S7 [        Familiar with Linux environments.  4 i6 L) L# j5 S$ }2 y/ F

4 |$ ?4 A) U) b: Q$ g/ Q9 iAny of the following is beneficial:
% k% c: t: B! b! w, ~% l        STA constraint design
6 v9 T7 ]' b; \1 n       Equivalence checking ?RTL to gates, and gates to gates.
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46#
發表於 2014-7-31 12:31:20 | 只看該作者
数字芯片设计工程师(DFT/综合)3 e. h3 J, T/ f  b  S% H
% H& w* s+ h8 O, q  P
公      司:A mobile chipset semiconductor company
2 z5 A$ X: }& i0 q' g工作地点:上海
' g9 X$ _: ?, X6 G9 B; o" Y0 H8 `9 F& B! c" K% X5 x3 R9 O
职位描述: 7 N% I5 V/ n% e: @( E
1、To provide and support SYN&DFT work for several projects in parallel  
! e$ J, ~( x( k! ^2、Run block level implementation for each project, include synthesis, DFT and LEC 4 M  F& E: B) X& ~
3、Support block level physical evaluation  7 o% `) O0 N) W8 G0 t
4、co-work with designer and provide block level SDC file
$ r1 N3 f. {0 h- e5、co-work with Back-end team for timing signoff( a& P5 V) y3 G, S. o$ i

* ?4 y4 T5 {1 X- a; v职位需求:
; v! R' a/ x( {- {3 q1. 了解集成电路设计的基本流程
9 B8 S: |1 Y: S8 R0 n' c6 ~/ ]2. 相关Synthesis, formal check 和DFT的工作经验。(3A, 3B, 3C精通一项即可)
  w: S) H1 i1 M+ Q3A. 有超过2~3个项目的synthesis 经验, 用过RTL compiler且熟悉timing的相关知识  
6 N; Y8 G! T$ Y3B. 有超过2~3个项目的formal check经验,熟悉CPF的low power flow % Z& l  p6 q) T6 o
3C. 有超过2~3个项目的DFT insertion经验, 用过Mentor DFT的优先考虑
: C: F1 k! ]$ K3. 具有良好的英语阅读和书写能力。
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47#
發表於 2014-10-29 08:13:11 | 只看該作者

ASIC Corporation將展示節能、高頻寬效率的C-RAN解決方案

西班牙巴賽隆納--(美國商業資訊)--eASIC Corporation:
$ e& D& H& R0 @& K
/ L* `4 ]. `6 A- g  _  P0 U8 v+ S人物:
" c% }7 u& N& ]& z. x3 s' I/ {' w
領先的單光罩自適應ASIC設備供應商eASIC Corporation將由eASIC無線業務主管Christian Lanzani博士擔任代表,負責整體無線策略,包括無線存取、去程傳輸(fronthaul)連線、基頻處理和回程傳輸解決方案。
  r8 h$ X9 H' F& c7 u
4 _! M1 L( _! f4 V, U7 d) k事件:* H& a, t, U% o; Z- u7 h3 H+ k

4 ~# Y$ q; O( R# w2 y4 t. jeASIC將作為聯合贊助商參加Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會(Wi-Fi World Summit & Fronthaul & C-RAN Summit),展示C-RAN去程傳輸在部署方面的挑戰,提供eASIC解決方案的細節。展示過程將包括無線存取、CPRI over OTN轉換器和基頻集區,包括L1硬體加速的使用案例。: Y+ s2 R/ F' C8 W( C
: ?' p5 P$ _" b% ]" w& [
時間:2014年10月29日,週三
1 j' C. o4 {0 G! y地點:西班牙巴賽隆納赫斯珀裡亞塔樓酒店(Hesperia Tower Hotel) ' r# Y7 t0 h$ \' x! Y9 m$ s9 n
* g6 o. n+ t  `/ r0 \; @1 O
如需瞭解有關eASIC Corporation的更多資訊,請造訪www.easic.com。Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會細節可以從以下網址獲得:http://wifiworldsummit.com/
# O& L$ q+ ^5 ?1 c& K/ `
0 e3 |. k7 A9 F  j; R0 y關於eASIC
) {$ K: O$ X3 ^$ s  A
% k" S- ^& [# E5 L# C- x1 NeASIC是一家無晶圓廠半導體公司,提供突破性的單光罩自適應ASIC設備,旨在顯著降低客製化半導體設備的整體成本和縮短投產時間。使用通孔層客製路由的專利技術實現了低成本、高性能和快速周轉ASIC及單晶片系統設計。這種創新構造使eASIC能夠提供前期成本顯著低於傳統ASIC的新一代ASIC。eASIC Corporation是一家私人公司,總部位於加州聖塔克拉拉。投資人包括Khosla Ventures、Kleiner Perkins Caufield and Byers (KPCB)、Crescendo Ventures、希捷(Seagate Technology, NASDAQ:STX)和Evergreen Partners。如需eASIC的更多資訊,請造訪www.easic.com
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48#
發表於 2015-2-23 20:44:05 | 只看該作者
Asic 的利基市場和 Fpga的利基市場 各有千秋.. x$ g: k* g# D7 D) Z
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49#
發表於 2015-7-23 21:32:34 | 只看該作者
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