5/11 Taiwan Yield Forum 2010

chip123

2010 Technology and Applications Forum
Sponsored by Rudolph Technologies

Returning to Hsinchu, Tuesday, May 11
Ambassador Hotel, 188 Chung Hwa Road

• Inspection and Metrology Process Characterization
• Cost-saving Yield Management Solutions
• Process Control Solutions-Fabwide
• Guest speakers from Top Fabs, Equipment Manufacturers
• SEMATECH's 3D Interconnect Program: Using all-surface inspection in an R&D environment

2010 Agenda Highlights

Wafer Fab (front-end)
All-surface inspection for immersion lithography
Advanced macro CMP monitoring
Defect analysis/signature pattern characterization
Characterization of High k/metal gate using MetaPULSE
Improving the COO model for thin film metrology
On product monitoring of Cu Seed Barrier
Focused beam ellipsometry for advanced applications: gate oxide,
     ONO, SiGe
Real-time fault prediction using ARTIST FDC
System Integration: Optimizing resources for improved yield

Assembly & Test (back-end)
Inspection trends in the back-end
Reducing review for back-end processes
Challenges in inspecting fan-out wafer level packages
Solutions and approaches to TSV inspection and metrology
CMOS image sensor inspection solutions
3D Inspection, RDL and Gold bump
-------------------------------------------------
0830- Registration, Refreshments
0900- Welcome, Keynote Address
1230- One-hour lunch
1700- Refreshments

This event is free of charge and includes parking.
Registration closes May 7.

Register Today