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招聘公司:A semiconductor technology development company
& _, g4 }$ T' u2 T. I招聘岗位:MEMS BONDING PROCESS DEVELOPMENT ENGINEER
, R8 f# y2 X o# G, u7 T8 |工作地点:Wuxi
% t" P' F. J n+ p" L$ u$ o+ t" G0 \# w% j0 w( c8 O6 R- R
岗位描述:
/ H# q. v, m$ d/ J( FKey Tasks/Duties/Responsibilities of this Position: – This position will implement wafer bonding technology integration know how for Micro Electrical Mechanical Systems (MEMS) applications i.e. accelerometers, gyros, print heads, pressure sensors, etc. and will define process flow based on customer requirements. Responsibilities: – Implement wafer bonding solutions for a wide variety of materials. – Create and support pretreatment, activation, and bond processes needed by customers and insure that these processes are stable and effective. – Use IR, acoustic methods, as well as other metrology techniques to evaluate bond quality. – Utilize SPC monitoring to control processes within the area to target levels as defined by customer goals. Insure that the correct SPC metrics are being tracked. – Troubleshoot process interaction issues on developmental and customer processes to insure compatibility. – Assist in the development of new and novel MEMS technologies. – Work with customers on novel material integration and develop solutions. – Develop and communicate/present technical material |
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