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Mechanical Design Engineer
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公 司:A US semiconductor equipment company$ n# w* Q4 k: z/ l9 a; y* O
工作地点:苏州
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职位描述
: z6 p" Q2 c7 v* V8 M6 l5 EMechanical design for power electronic units and sub assemblies (converter, inverter, cooler…) for hybrid / electronic vehicles and non-automotive products.
; I8 k. T6 y, ], e; n2D, 3D Designing (ProE) according to pre-defined technical requirements, holding time line and quality; 3 P# L/ o1 G& A$ t5 _9 b
Product responsibility of power electronic units and sub assemblies (converter, inverter, cooler, housing…) 2 i" z# h3 H# l
Design coordination with internal and external departments (MD, Hardware, Layout etc.) & s# U; Y' e+ q4 R! o- y6 l
Collaboration with international suppliers
6 n2 d3 U8 {& mWorking according to product engineering in simultaneous engineering team from concept phase to series production
( z. D% L" z" R: ^+ V$ V2 @ FResponsible for regular design reviews in the SE team.
" v2 |6 t0 M( r# b( R$ wResponsible of choosing appropriate assembly and interconnection technologies and manufacturing processes V3 k2 w4 W, x& o9 f% |
5 y# `# E+ K8 c8 P8 q) B& x职位要求
* J- C- q/ f# E7 ~3 a, B! HRequirements:
& t" l3 T- \( o2 b$ D1 |Education: Completed master study or higher in Mechanical Engineer, Design Engineer, Plastic Engineer - z; y6 j+ r$ M, W0 @
Working Experience : have experience in high power electronic design or similar area for 2 or more years + X7 B! f) }4 t
Knowledge in working acc. to product engineering
6 T; {: |/ x. r, D/ Y7 JKnowledge/Skills:"Fundamental know how regarding die casting process and materials, bending stamping and forging processes and materials, high power interconnection. Basic knowledge of plastic engineering. Experience in working with ProE and PDMLink. ; s- m H- F# D1 j" s1 g$ D* C" d
knowledge in DRBFM L3 or higher |
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