時 間 | 議 題 | 講 師 |
09:00~09:20 | Registration | |
09:20~09:50 | Trend and market for IC Package Material | 工研院IEK |
蕭傳議 產業分析師 | ||
09:50~10:10 | Break | |
10:10~11:00 | Embedded technology for substrate and component materials | 工研院 材化所 |
金進興 副組長 | ||
11:00~11:50 | The development of EOPCB and its waveguide materials | 工研院 電光所 |
胡鴻烈 經理(暫定) |
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