& ^' F9 s" F6 M* ~3 PPosition Summary: - ^( N4 b0 G/ @7 g+ {7 A
Working closely with both R&D and Application Engineering teams and responsible for defining and supporting IC-Package-PCB power and signal integrity solutions including product specification, technical marketing and carrying out customer evaluation, benchmark and support 1 m- H5 ]. r: e4 w2 |8 X1 M9 w/ Q: l* H$ f7 E( X3 o. @! M
Essential Job Functions/Accountabilities: ' p1 V8 H: i- d2 P: ?7 h
working with both R&D and Application Engineering teams 3 q. c2 {$ a4 \% R( b6 @+ H responsible for defining and supporting IC-Package-PCB power and signal integrity solutions * \- s6 D& i3 d( I1 Y* u product specification, technical marketing ; W" y% n# J {3 t
carrying out customer evaluation, benchmark and support 1 a* T* }/ Q+ e Solid background in numerical electromagnetic simulation solutions with FEM or MoM * m' D5 e3 `+ z& A3 V% ~% U Experience with package and PCB modeling and related signal and power integrity issues ' h0 C; l7 ]8 D4 i p# _* M
Minimum Requirements/Qualifications: " V0 S1 B: `0 `: `1 i6 `0 N4 @
M.S. or Ph.D. majoring in Electrical Engineering, Physics or other related areas 1 f2 @2 |- \- ^- ?; o+ U: L, | 3 years of experience, or equivalent combination of education and experience 3 _9 {+ D+ E7 Q" Y5 V S1 X$ v+ ` Experience in Semi conduct/EDA industry is much preferred 8 p4 i Z4 `) O! i- P7 q
Self motivation, teamwork and strong English communication skills (both written and oral)作者: ranica 時間: 2013-11-26 09:26 AM
Electronics Design Engineer ! S' c- b: t# r$ _8 H * R& A7 v1 q( U, n% A公 司:an international group of companies- i4 K( d: m: c9 I1 @: ]7 t
工作地点:汕头" }0 f, o- [" `% n1 t
& c3 {# I& x& ?' ?- EResponsibilities will include + x1 v- _8 J, G" ]
? Electrical design including microprocessor system from concept through to production. , v4 N3 {: P: y6 P6 o1 i
? Schematic capture, simulation, PCB layout. 2 F1 p' k( a3 c" O* |2 p% L? Embedded software development in C * o/ l, J, F6 w! T- k! W7 ^
? Design and pass appropriate EMC requirements & B' N; |$ t B0 J9 V+ F5 m- G8 N? Generate innovative product concepts/solutions / a1 b, c8 S; ~4 Y, Q1 X
? Develop functional specifications for new products + ? L& D* T% q/ J3 v; P; k$ l
? Prepare and release of component specifications and Bill of Materials. 8 \9 O( x) L2 L9 J) O/ n8 D% e
? Product test speciation including writing the spec and implementing tests 3 V5 W$ D+ X7 z2 Q2 F/ T$ Y
? Managing / coordinating engineering changes and maintain detailed design records 6 x8 t4 l) i/ ?! b? Coordinate/organize prototype builds, fault finding, samples tracking, and field evaluation for NPD 9 J7 v! `/ m9 ~! J5 R& f( L
? provide technical support to sales, marketing, production, quality and purchasing 4 P4 [, P& r* u# H1 j. O
? Working closely with the global R&D hardware / software teams & X* ~. G) \& [" I1 s
5 G. S, Y9 l; W7 \Preferable Skills " B) l" t# b* c! k% O' c0 u? HW/FW technical lead in NPD process * l& L7 |$ V# b$ c+ p
? Experience in the design and application of sensing technology products ' r" u; Z; j. C8 [" ~4 z? Experience in the design of Audio products and Switched Mode Power Supplies. , n2 ^3 Z) f; s3 }1 S? Experience in infra-red and wireless technology. ! K, v% D1 `6 X- |0 G) Z
? Understanding of optical design - N) J8 e+ h. h$ y I3 F
$ e/ g2 v% O" B" ^Benefits: 3 \* v( m% D! b/ z$ m) a6 s? Competitive salary. 3 y* ~+ F/ S: Y? Contributory pension. # f3 A" @6 d& B, Z, P2 r/ k5 Y! N# I3 H j# m. Y/ ~. t/ z( X
This is an exciting opportunity for a pro-active and highly motivated individual who is driven, ambitious and can make a positive impact to the future of **作者: atitizz 時間: 2013-12-2 11:41 AM
Molex堅固耐用的元件為大功率開關和嚴苛條件應用提供出色的 EMI/RFI保護 ! N0 o0 B: j& E( r: k v2 i# u
Woodhead® MAX-LOC® Plus 遮罩塞繩結頭組件可降低有害雜訊的影響,並且提供節省成本和人力的簡單安裝 D1 w; C" l. g4 O