標題: 請問在畫IC佈局時~有哪些問題需要考慮的~ [打印本頁] 作者: vadj 時間: 2007-11-8 01:12 AM 標題: 請問在畫IC佈局時~有哪些問題需要考慮的~ 請問在畫IC佈局時~有哪些問題需要考慮的~ + U7 j/ U' y! |* U2 c例如天線效應、對稱性、latchu s" y8 ?) W5 \0 g% ?& l請問還有些什麼呢？6 E" D6 r$ u9 |; v) t
PS 先不管是畫什麼電路，就請先說一些基本一定會考量到的問題。謝謝作者: 小朱仔 時間: 2007-11-8 01:53 PM
很重要的一點 - u6 ]* {" \: x耐電流& D+ V% |: k6 N, s/ B& U9 o
每條走線的耐電流 & [& [/ k5 @( K3 TI/O Pad的電流 1 [7 t, M. u- J' S8 {! dIR Drop 5 l: |/ E2 a7 |Matching - M2 U+ R6 o$ r& M' [5 @, f; i 3 n( ]" \# l! P/ ?2 c/ Hetc....作者: billionwong 時間: 2007-11-12 10:38 AM
1. Chip size. You need to know what kinds of package will be used.8 _( ^1 z' \2 n; z2 g( H8 w1 v- c
2. Pad location. You need to confirm with supplier about the bond wire bonding.0 P J( }! F1 K7 o, H& G, A
3. ESD and latchup consideration. 6 C% h# m m$ N9 \+ H
4. Any noisy circuit inside the circuit. If yes, you may need to isolate those noisy circuits with double guard ring or individual ground and power path. / T6 y3 Q+ y+ k5. The current consumption on the whole circuit. It will affect the metal width of each building block and the whole circuit.# q8 I7 t0 K5 I. L% N1 C( } n
6. Make sure there is no softcon connection. + k" Q8 }0 W1 F/ T; N7. How many metal layers could be used ?6 i6 r/ b' z& M5 J
8. Metal Density consideration.作者: bjic 時間: 2007-11-12 04:14 PM
问客户，做客户想要的。也就是前端工程师 7 s2 P1 }6 W7 `8 E当然有时候还要凭自己的经验判断。作者: yoyo20701 時間: 2007-12-22 06:26 PM
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